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Microscale Thermal and Power Management
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generating power from heat - cooling and temperature control
power generation
Nextreme's miniature, embedded thermoelectric generators (eTEG) convert waste heat directly into electricity for clean energy applications. Using advanced thin-film technology, Nextreme delivers the world’s smallest thermoelectric generator with the highest output power density. Converting temperature differences of as little as 5°C into electrical power, the eTEG is ideal for powering gas sensors; trickle charging wireless sensors in dark or remote places; and improving fuel efficiency in automobiles.
more info eTEG UPF40
eTEG device - Embedded thermoelectric
generator converts heat into electricity
cooling and temp. control
Whether you need to cool a hot spot, maintain operating temperature ranges for optimal performance or channel heat away from sensitive electronics, Nextreme’s embedded thermoelectric cooling (eTEC) technology enables micro-scale thermal management products for precision temperature control. By cooling as close to the heat source as possible and with the smallest devices on the market, Nextreme provides a new approach to solving thermal challenges in a variety of markets and applications.
OptoCooler UPF4 more info
OptoCooler ™ UPF4 - Optimized for
optoelectronic applications

The Nextreme Advantage
  • Ultra-thin - 0.65 mm high or less
  • Ultra-small - footprints down to 2.9 mm²
  • Extremely fast - <2 msec response
  • Solid-state - particle free, clean-room manufacturing
Thermal Copper Pillar Bump
Nextreme has embedded cooling and power generation capabilities into the widely accepted copper pillar bumping process used in high-volume electronic packaging.Now, solder bumps can go beyond mechanical and electrical functionality and begin to address thermal and power issues in the package.
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Breakthrough Technology
Nextreme’s breakthrough eTEC and eTEG thin-film thermoelectric technologies address the most challenging thermal and power management issues in electronics today.

Only Nextreme can deliver a:

  • Cooling solution at the source of the heat
  • Radically new approach to generating power from waste heat
  • Fully-scalable technology solution at the wafer, chip, board and system levels
  • Seamless design-in solution integrates into your existing or future packaging with a minimum of retooling


Cooling Applications at the Source Generating Power from Heat