NEW! OptoCooler™ UPF40 Module The new UPF40 module is ideal for opto-electronics applications with high heat-flux requirements, particularly semiconductor optical amplifiers (SOA) and laser diodes. Learn more >
	OptoCooler™ UPF4 Module The UPF4 module's microscopic size and high heat pumping capability are particularly well suited for opto-electronics applications. Learn more >
	Thermal Copper Pillar Bump Nextreme has integrated cooling and power generation into the widely accepted copper pillar bumping process used in high-volume electronic packaging. Learn more >> | FAQs
	Embedded Thermoelectric Cooler eTEC™ Nextreme’s miniature, thin-film eTECs offers an industry first — a micro-refrigerator the size of a piece of confetti that enables active, solid-state temperature control in close proximity to a heat source. Learn more >
	Embedded Power Generators eTEG™ Nextreme's miniature, thin film thermoelectric generator (eTEG™) converts heat directly into electricity. Learn more >

Nextreme Thermal Solutions is the leader in microscale thermal and power management products for the electronics, telecommunications, medical, industrial, and aerospace & defense industries.

• Nextreme is Awarded NC Green Business Fund Grant to Enhance Efficiency of Thermoelectrics
• Nextreme Thermal Solutions and Princeton Lightwave to Jointly Develop Power Efficient Cooling Solutions for Next Generation Imaging Sensors
• Nextreme Announces New OptoCooler UPF40 Module for High Heat-flux Applications

• Semiconductor International: Nextreme Announces New OptoCooler™ Thermoelectric Platform
• Advanced Packaging: Nextreme Introduces Thermal Copper Pillar Bump
• EE Times: Nanotech for flip-chips blows hot and cold