The development of thermal systems incorporating thin-film thermoelectric can be accelerated by Nextreme support. Nextreme’s years of integration experience can enable rapid and more successful prototyping and accelerate a program as well as reduce costly program delays. Nextreme provides the following services:

Prototyping
Prototyping of subsystems that involve integration of TE devices.  This includes the following activities:

• Thermoelectric device integration with the heat source
• Integration of necessary thermal rejections including heat sinks, heat pipes, heat spreaders and thermal interface materials
• Incorporation into complex systems for improved TE device performance

Test & Measurement
Thermal testing of systems and components can be particularly difficult, especially at the small scales associated with thin-film TE devices. Nextreme provides assistance in evaluating and benchmarking systems. Also included in this category is qualification and reliability testing.  The following services are available:

• System-level diagnostics (LabVIEW™ driven drivers and data acquisition)
• Thermal imaging (IR)
• Environment stress testing (reliability)
• Power cycling
• Thermal cycling

Custom Product Development
In the course of evaluating a customer’s needs for active cooling or power generation, it may become evident that standard product offerings do not provide optimal performance. In such cases, Nextreme provides custom TE device product development. This typically follows a modeling and design activity. A custom product provides the customer with a device optimized for thermal management, power (input or output) conditions, efficiency and form factor.

On-site Engineering Support
Initial evaluation and integration of thin-film TE devices is often a challenge due to the size of Nextreme’s devices. Nextreme provides on-site engineering support to customers to reduce the barriers to a successful first integration. Nextreme’s experienced field engineering staff will provide assistance in integration, driving and testing of the devices at the customer’s facility.