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Microscale Thermal and Power Management
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technology overview

Nextreme designs and manufactures micro-scale thermal and power management products that overcome thermal and power constraints in electronics for the semiconductor, photonics, consumer, automotive and government/aerospace industries.

Cooling and Temperature Control
Nextreme's thermoelectric products make use of the Peltier Effect: When an electric current is driven through a circuit containing two dissimilar materials, heat is absorbed at one junction (the cold side) and released at the other junction (the hot side). This enables the devices to either cool or heat whatever they are in contact with, depending on the applied dc polarity.

Power Generation
Nextreme’s devices can generate electrical power via the Seebeck Effect, where electricity is produced from a temperature differential arising from heat flow across the TEC.

Nextreme Technology Advantage
Nextreme has integrated cooling and power generation into the widely accepted copper pillar bumping process used in high-volume electronic packaging. This breakthrough addresses two of the most serious issues in electronics today – thermal and power management constraints. Nextreme’s approach uses proven, fully scalable technology to deliver new, enabling functionality in a variety of applications.

Contact us for evaluation, analysis, prototype, test, verification or production assistance, or call us at +1 919-597-7300.

Nextreme OptoCooler Exposed
Exploded view of the OptoCooler UPF4


Thermal Bump at Work The thermal bump at work

Thermal bump on a flip chip
Thermal bump on a flip chip