2011
Thermal Harvesting and Storage: a Heavenly Match | Electronic Products | December 2011
Thermal Management | ECN | July 2011
2010
Thin-film thermoelectrics cool optoelectronics | Electronic Products | May 2010
Active heat removal cools electronics hot spots | EDN | March 2010
Thermal energy harvesting for distributed sensors | Electronic Products | February 2010
2009
Cooling at the Heat Source | Electronics | October 2009
Thermal Management and Heat Rejection for LED Cooling | LED Journal | September 2009
The Case for Thermal Energy Scavenging for Sensor Networks | ECN | August 2009
Board-level Thermal Management: 3D Heat Removal | SMT | July 2009
Thermal management: a hot topic | FibreSystems Europe | July 2009
Active Thermal Management for Cooler Body Armor | Defense Tech Briefs | June 2009
Energy Harvesting with Thin-Film Thermoelectrics | Electronic Products | June 2009
Semiconductor Test's Active evolution | R&D Magazine | June 2009
Brainstorm: Do-it-Yourself-Power | ECN | April 2009
Cooling Needs to Start at the Chip Level | SMT | March 2009
Thin-film TEGs Convert Waste Heat to Clean Energy | Electronic Products | March 2009
Localized Cooling for Data Centers | Advanced Packaging | Jan/Feb 2009
2008
INSTRUMENTATION: Thin-film thermoelectric technology makes optoelectronics ‘cool’ | Laser Focus World | December 2008
A New Thermal-Management Paradigm for Power Devices | Power Electronics Technology | November 2008
Cooling 3D Packages with Thin-film Thermoelectrics | Advanced Packaging | October 2008
Temperature Stabilization for MEMS Devices | Advanced Packaging | September 2008
Enabling Cooling Strategies for 3D packages | Advanced Packaging | July 2008
Implementing Thermal Bumps in New Product Designs | Photonics Tech Briefs | July 2008
Without Thermal Analysis, You Might Get Burned | Electronic Design | July 2008
Scanning for Ideas: Thin-Film Device Keeps Chips and Lasers Cool | Machine Design | June 2008
Thermoelectrically Cool your Chip Designs | EE Times | April 2008
Thin-film TECs for High-heat Flux Rapid Thermal Response | Advanced Packaging | March 2008
Thermoelectric Platform Aims to Cool Hot Spots | EDN Europe | March 2008
The Thermal CPB: An Approach to Thermal and Power Management | Advanced Packaging | January 2008