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Microscale Thermal and Power Management
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articles

Read articles written by Nextreme in the major trade media outlets that cover a variety of thermal and power management topics

2011

Thermal Harvesting and Storage: a Heavenly Match | Electronic Products | December 2011

Thermal Energy Harvesting for Distributed Sensors and Sensor Networks | Electronic Design | September 2011

Thermal Management | ECN | July 2011

2010

Thin-film thermoelectrics cool optoelectronics | Electronic Products | May 2010

Active heat removal cools electronics hot spots | EDN | March 2010

Thermal energy harvesting for distributed sensors | Electronic Products | February 2010

2009

Cooling at the Heat Source | Electronics | October 2009

Thermal Management and Heat Rejection for LED Cooling | LED Journal | September 2009

The Case for Thermal Energy Scavenging for Sensor Networks | ECN | August 2009

Board-level Thermal Management: 3D Heat Removal | SMT | July 2009

Thermal management: a hot topic | FibreSystems Europe | July 2009

Active Thermal Management for Cooler Body Armor | Defense Tech Briefs | June 2009

Energy Harvesting with Thin-Film Thermoelectrics | Electronic Products | June 2009

Semiconductor Test's Active evolution | R&D Magazine | June 2009

Brainstorm: Do-it-Yourself-Power | ECN | April 2009

Cooling Needs to Start at the Chip Level | SMT | March 2009

Die and Board Level Hot Spots - Thermal challenges need design solutions | Power Systems Design Europe | March 2009

Thin-film TEGs Convert Waste Heat to Clean Energy | Electronic Products | March 2009

Localized Cooling for Data Centers | Advanced Packaging | Jan/Feb 2009

2008

INSTRUMENTATION: Thin-film thermoelectric technology makes optoelectronics ‘cool’ | Laser Focus World | December 2008

A New Thermal-Management Paradigm for Power Devices | Power Electronics Technology | November 2008

Cooling 3D Packages with Thin-film Thermoelectrics | Advanced Packaging | October 2008

Cooling High-Power LED Packages with Thin-Film Thermoelectric Technology | LED Journal | Sept/Oct 2008

Temperature Stabilization for MEMS Devices | Advanced Packaging | September 2008

Enabling Cooling Strategies for 3D packages | Advanced Packaging | July 2008

Implementing Thermal Bumps in New Product Designs | Photonics Tech Briefs | July 2008

Without Thermal Analysis, You Might Get Burned | Electronic Design | July 2008

Scanning for Ideas: Thin-Film Device Keeps Chips and Lasers Cool | Machine Design | June 2008

Thermoelectrically Cool your Chip Designs | EE Times | April 2008

Thin-film TECs for High-heat Flux Rapid Thermal Response | Advanced Packaging | March 2008

Thermoelectric Platform Aims to Cool Hot Spots | EDN Europe | March 2008

The Thermal CPB: An Approach to Thermal and Power Management | Advanced Packaging | January 2008