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These reports address thermal and power management problems and how to solve them.
Cooling and Temperature Control
The Thermal Copper Pillar Bump: Enabling Improved Semiconductor Performance Without Sacrificing Efficiency
Embedded Thermoelectrics: Site-Specific Cooling of Integrated Circuits for Enhanced Reliability and Thermal Performance
Embedded Thermoelectrics: Hot Spot or Whole Chip Cooling of FPGA Devices for Enhanced Reliability and Thermal Performance
Power Generation
Design Considerations for TEG System Optimization
Thin Film Thermoelectric Power Generation: Enabling Waste Heat Recovery in High Heat Flux Environments
