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LED Journal
Sept/Oct 2008
Cooling High-Power LED Packages with Thin-Film Thermoelectric Technology
Photonics Tech Briefs
July 2008
Implementing Thermal Bumps in New Product Designs
Electronic Design
July 10, 2008
Without thermal Analysis, You Might get Burned
Machine Design
June 2, 2008
Scanning for Ideas: Thin-Film Device Keeps Chips and Lasers Cool
EE Times
April 28, 2008
Thermoelectrically Cool your Chip Designs
Semiconductor International
March 1, 2008
Thermal Copper Pillar Bumps for Thermal, Power Management
EDN Europe
March 1, 2008
Thermoelectric Platform Aims to Cool Hot Spots
Advanced Packaging
January 2008
The Thermal CPB: An Approach to Thermal and Power Management
Military Embedded Systems
Nov/Dec 2007
Embedded thermoelectrics: Cooling ICs in Harsh Environments
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