Laser diodes traditionally have used thermoelectric coolers (TECs) for precision temperature control to improve diode output levels and maintain wavelength integrity. A major trend for photonics in telecommunications has been the move to packaging that is smaller and less expensive. This in turn will open the door for higher volume manufacturing. In the course of this transition, conventional TEC solutions have become increasingly difficult to implement as their size and power densities have not kept pace with the demands of optoelectronic technology.

Nextreme’s thin-film thermoelectric coolers have demonstrated a heat pumping capacity that far exceeds that provided by traditional bulk TEC products.  This makes thin-film TECs ideally suited for high heat density applications. In addition to the increased heat pumping capability, the use of thin films will allow for truly novel and new implementations of TE devices. By taking advantage of the smaller; thinner form-factor, a new approach is enabled for electronic thermal management that focuses on providing appropriate cooling only when and where it is needed within the optoelectronic system.

Laser Diode Cooling Test

Nextreme recently conducted a test to demonstrate the benefits of cooling a laser diode with an OptoCooler HV14 module. A laser diode was mounted on the top side of a module in a TO-8 package and a test bed was assembled to measure the effects of cooling on laser output and wavelength. Click here to download the test report.

Click to view cooling video Download test report

Nextreme Products for Laser Diode Cooling

UPF4 – small enough to be embedded into a TO-56 or TO-8 can. More >

HV14 - a high voltage, low current thermoelectric cooler designed for standard electrical power requirements.  Also fits into standard packages. More >