Nextreme Honored By Electronic Products with 2007 Product of the Year Award

Nextreme’s miniature thin film eTEC™ recognized as a 2007 Product of the Year…

DURHAM, N.C. (March 31, 2008) — Nextreme Thermal Solutions™, the leader in microscale thermal and power management products for the electronics industry, has received a 2007 Product of the Year award from Electronic Products Magazine for its miniature, thin-film embedded thermoelectric component (eTEC™) technology.  The award was presented during a ceremony at Nextreme’s new manufacturing and R&D facility in Durham, NC.

“The Product of the Year award was established to identify and reward products that are innovative in their design, represent a significant advancement in a technology or its application, and display a substantial achievement in the price and/or performance of the device,” said Ralph Raiola, Electronic Products editor.

With thin-film thermal bump technology at its core, Nextreme’s products can achieve temperature differentials of up to 50ºC at room temperature. This achievement compares favorably with the performance of conventional thermoelectric technology, which is physically larger and unlike the thermal bump, cannot be integrated directly into the electronic packaging process. Nextreme devices employ proprietary materials that are 5–15um thick, about 100 times thinner than the typical 1mm thick pellets used in conventional thermoelectric devices.

Adding as little as 100 microns (0.1mm) of thickness to a heat spreader or package, a reliable eTEC can be seamlessly integrated close to the heat source. The eTEC’s ultra-fast, millisecond response time rapidly cools or heats to maintain a precise temperature depending on the needs of the application. Heat fluxes of >150W/cm2 have been demonstrated versus 10–20 W/cm2 for typical bulk TECs.

“We are honored to receive a 2007 Product of the Year award from Electronic Products for our miniature thin film eTEC™ technology,” said Jesko von Windheim, CEO at Nextreme. “This award recognizes our commitment to new products that address serious thermal management issues in the electronics, telecommunications, medical, industrial and aerospace & defense industries.”

view all news