RTI International, Nextreme Thermal Solutions 'Hot Spot' Electronics Chip Cooler Technology Earns R&D 100 Award

RESEARCH TRIANGLE PARK, NC (July 9, 2010)—RTI International and Nextreme Thermal Solutions, a spin-off of RTI, won a prestigious "R&D 100" award for the development of a chip-scale thermoelectric cooler that can be used to provide a unique and effective solution for thermal problems of high-performance computer and electronic chips.

The annual R&D 100 award, sponsored by the trade journal R&D Magazine, honors the 100 most significant new technologies of the past year.

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