nextreme logo
Microscale Thermal and Power Management
Home  |  contact us  |  buy  |  log-in 
+1 rss
press release

RTI International, Nextreme Thermal Solutions 'Hot Spot' Electronics Chip Cooler Technology Earns R&D 100 Award

RESEARCH TRIANGLE PARK, NC (July 9, 2010)—RTI International and Nextreme Thermal Solutions, a spin-off of RTI, won a prestigious "R&D 100" award for the development of a chip-scale thermoelectric cooler that can be used to provide a unique and effective solution for thermal problems of high-performance computer and electronic chips.

The annual R&D 100 award, sponsored by the trade journal R&D Magazine, honors the 100 most significant new technologies of the past year.

Click to view the full press release at RTI International >

Click to learn more about the innovation >


view all news